MULTIPLE ZONE HEATED ENCLOSURE FOR OPTIMIZED SUBLIMATION OF SOLID-PHASE PRECURSORS
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Jul 26, 2022
filing date -
Jul 26, 2022
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Abstract
A heated enclosure for optimized sublimation of solid-phase semiconductor process materials and subsequent delivery of the resultant vapor. The enclosure has a hollow housing which is insulated to retain heat within the enclosure. The enclosure further has at least two independent heated zones with independent temperature controls and dedicated overtemperature protection defining an upper heated zone and a lower heated zone and being located in the housing. The lower heated zone is configured to accept a container storing a solid-phase semiconductor process material. The enclosure still further has a removable and height-adjustable divider plate being made of an insulation material, separating the upper heated zone and the lower heated zone, and minimizing heat transfer between the upper heated zone and the lower heated zone.
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