POWER AMPLIFICATION DEVICE
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 24, 2024
filing date -
Sep 24, 2024
priority date (Note) -
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Abstract
A substrate and a chip device mounted on a main surface of the substrate are provided. The chip device is provided with a first differential amplifier including a first carrier amplifier and a second carrier amplifier, and a second differential amplifier including a first peak amplifier and a second peak amplifier. In the chip device, the first carrier amplifier and the second carrier amplifier are disposed side by side in a first direction, the first carrier amplifier and the first peak amplifier are disposed side by side in a second direction different from the first direction, the first peak amplifier and the second peak amplifier are disposed side by side in the first direction, and the second carrier amplifier and the second peak amplifier are disposed side by side in the second direction.
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