ANTENNA-IN-PACKAGE WITH HEAT DISSIPATION STRUCTURE
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 26, 2023
filing date -
Sep 26, 2023
priority date (Note) -
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Abstract
An antenna-in-package with a heat dissipation structure includes a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a chassis, and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrate is disposed above the first surface of the circuit board. The chip is disposed between the antenna substrate and the first surface of the circuit board and is electrically connected to the antenna substrate. The plurality of heat dissipation fins protrude from the second surface of the circuit board. The chassis encapsulates the circuit board, the antenna substrate, the chip, and the plurality of heat dissipation fins. The dielectric fluid circulates and flows in the chassis through a cooling circulation device and is in direct contact with the plurality of heat dissipation fins.
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