SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING SOLDERING APPARATUS
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
May 21, 2024
filing date -
May 21, 2024
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Abstract
A soldering apparatus includes a stage on which a plurality of electronic devices are loaded, a light source disposed on the stage and configured to cast light toward the plurality of electronic devices, and a mask film disposed between the light source and the plurality of electronic devices. The mask film has openings exposing at least a portion of each of the plurality of electronic devices and a guide is connected to the mask film and extends toward the plurality of electronic devices. The guide includes a reflective material.
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