SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Apr 12, 2024
filing date -
Apr 12, 2024
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Abstract
A semiconductor chip according to an embodiment includes a semiconductor substrate, an interconnection pad on a first surface of the semiconductor substrate, an insulation layer being on the first surface of the semiconductor substrate and defining an opening that exposes at least a partial portion of the interconnection pad, a capping pad being on the insulation layer and being connected to the interconnection pad through the opening, and an insulation structure at a periphery of the capping pad on the insulation layer.
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