SEMICONDUCTOR DEVICE HAVING DUMMY PAD AND METHOD FOR FORMING THE SAME
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Nov 20, 2023
filing date -
Nov 20, 2023
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Abstract
In certain aspects, a semiconductor device includes a device layer, a dummy pad, a dielectric structure between the device layer and the dummy pad and extending in a vertical direction, and an interconnect structure between the device layer and the dielectric structure and extending in the vertical direction. The dielectric structure, the interconnect structure, and the dummy pad are overlaid.
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