SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 9, 2024
filing date -
Sep 9, 2024
priority date (Note) -
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Abstract
A semiconductor package includes a redistribution structure including a redistribution layer including copper (Cu) and an insulating layer surrounding the redistribution layer, a semiconductor chip mounted on the redistribution structure and including connection pads, internal connection terminals between the redistribution structure and the semiconductor chip electrically connecting the redistribution layer to the connection pads, external connection terminals attached under the redistribution structure and electrically connected to the redistribution layer, and an encapsulant configured to surround the semiconductor chip and the internal connection terminals on the redistribution structure. The insulating layer includes an insulating material of which K is 20 to 100 in a TC index according to equation below.
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