Importance

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Abstract

An electronic device includes a package structure having four lateral corners, a semiconductor die at least partially enclosed inside the package structure and attached to a die attach pad, conductive leads at least partially exposed outside the package structure along the four lateral sides, a first one of the conductive leads electrically connected to the semiconductor die, an instance of a first conductive feature partially exposed outside the package structure at each of the corners, and an instance of a second conductive feature partially exposed outside the package structure and contacting a respective instance of the first conductive feature at each of the corners, the instance of the second conductive feature exposed outside the package structure along the first side.

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First Claim