SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Dec 5, 2023
filing date -
Dec 5, 2023
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Abstract
A method includes forming a dummy component, including: forming through-substrate vias (TSVs) in a substrate; forming a thermal structure over the TSVs, wherein the thermal structure includes metal lines in dielectric layers; forming a bonding layer over the thermal structure; and forming bond pads within the bonding layer; bonding the dummy component to a package component; and bonding a semiconductor die to the package component.
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