ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Jul 2, 2024
filing date -
Jul 2, 2024
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Abstract
An electronic package and a manufacturing method thereof are provided, in which a first barrier body and a second barrier body are disposed respectively, and a heat dissipation structure is formed with a hole thereon. Thereby, gas in the heat dissipation structure can be discharged via the hole, so as to prevent the gas from remaining in a thermal conductive layer and affecting the heat dissipation effect.
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