MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 27, 2025
app pub date -
Feb 5, 2024
filing date -
Feb 5, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A manufacturing method of a power module includes operations of bonding a semiconductor device to a lower substrate, disposing an upper bonding member on an upper portion of the semiconductor device; contacting a probe device with the upper bonding member, electrically connecting the probe device to a tester and testing electrical characteristics of the semiconductor device, and bonding an upper substrate to the semiconductor device through the upper bonding member.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully