HIGH-PRECISION HETEROGENEOUS INTEGRATION

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United States of America Patent

APP PUB NO 20250105009A1
SERIAL NO

18728885

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Abstract

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A method for implementing high-precision heterogeneous integration. An etch of a first bonding surface and a second bonding surface is performed to create nanostructures in the first bonding surface and/or the second bonding surface. The first and second bonding surfaces are bonded together, where a particle lands at a bonding interface resulting in an exclusion zone that is at least two times smaller than a bonding of two bonding surfaces with no nanostructures.

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Patent Owner(s)

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UNIV TEXASTEXAS USA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ajay, Paras Austin, US 27 36
Sreenivasan, Sidlgata V Austin, US 214 5594

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