HIGH-PRECISION HETEROGENEOUS INTEGRATION
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United States of America Patent
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Mar 27, 2025
app pub date -
Jan 13, 2023
filing date -
Jan 13, 2023
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Abstract
A method for implementing high-precision heterogeneous integration. An etch of a first bonding surface and a second bonding surface is performed to create nanostructures in the first bonding surface and/or the second bonding surface. The first and second bonding surfaces are bonded together, where a particle lands at a bonding interface resulting in an exclusion zone that is at least two times smaller than a bonding of two bonding surfaces with no nanostructures.
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