TIN COMPOUNDS CONTAINING A TIN-OXYGEN DOUBLE BOND, A PHOTORESIST COMPOSITION CONTAINING THE SAME AND A METHOD OF FORMING A PHOTORESIST PATTERN USING THE SAME

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United States of America Patent

APP PUB NO 20250102909A1
SERIAL NO

18891182

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Abstract

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A tin compound includes a tin-oxygen double bond, a photoresist composition including the same, and a method for forming a photoresist pattern using the same. In addition, a method for forming a photoresist pattern includes the step of dissociating an organic ligand of an organometallic compound upon light exposure to cause an addition reaction between metal molecules.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY77 YONGBONG-RO BUK-GU GWANGJU 61186

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JEONG, Hyun-Dam Gwangju, KR 5 28
KEE, Wonchul Gwangju, KR 1 0
LEE, Gahyun Gwangju, KR 2 0
YUN, Hyeok Jeollanam-do, KR 4 0

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