OPTICAL PACKAGING STRUCTURE FOR LIDAR
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Aug 8, 2024
filing date -
Aug 8, 2024
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Abstract
The present invention relates to the field of LIDAR technology, and in particular to an optical package structure for a LIDAR. An optical package structure for a LIDAR includes a housing; a laser transceiver component arranged in the housing, and configured to emit a laser and to receive for detection; a temperature control component arranged in the housing and connected to the laser transceiver component; and a conduction circuit board arranged on the housing and electrically connected to an external circuit board. The conduction circuit board is arranged to be electrically connected to the laser transceiver component. The optical package structure for the LIDAR according to the present invention is in a separated package form, is compact in structure and facilitates improving the versatility of the product; and a peripheral control circuit part thereof suitable for different scenarios can be designed by a user according to his or her own demands, so that the production and design costs for the user are reduced.
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