PROBE ASSEMBLY WITH MULTIPLE SPACERS AND METHODS OF ASSEMBLING THE SAME
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Dec 8, 2024
filing date -
Dec 8, 2024
priority date (Note) -
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Abstract
A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.
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