Importance

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Abstract

A test socket for integrated circuit (IC) testing is provided and comprises an insulating support structure and multiple conductive columns. The insulating support structure features multiple through-holes designed to accommodate the conductive columns. Parts of the conductive columns are embedded within the insulating support structure and extend through these through-holes to establish electrical connections for IC testing. The conductive columns are elastic, allowing them to accommodate variations caused by warpage of the IC packaging and the tolerances in BGA solder ball sizes. Additionally, the insulating support structure incorporates multiple grooves located next to the through-holes, where parts of the conductive columns are embedded, enhancing the fixation strength of the conductive columns to the insulating support structure. Furthermore, the test socket includes anti-short-circuit brackets positioned beside the conductive columns to prevent them from contacting each other and causing short circuits. The invention also provides a method for manufacturing this test socket.

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First Claim