AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 25, 2024
filing date -
Sep 25, 2024
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Abstract
Disclosed an airflow sensor and an airflow sensor packaging structure. The airflow sensor comprises a base, a vibrating electrode, and a fixed electrode in a stacked arrangement, wherein the base has a back cavity passing through in its thickness direction. it is intended that the fixed electrode of the air flow sensor is provided with a vent hole and the perimeter edge of the vibration sensitive area of the vibration electrode is provided with a pressure equalizing hole. In the thickness direction of the substrate, the pressure equalizing hole The projection overlaps with the projection of the vent hole, and the pressure equalizing hole, the vent hole and the gap layer channel jointly form an air release channel, which is conducive to the smooth diffusion of oil smoke entering the air flow sensor along the air release channel.
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