COMPOSITE MOLDED COMPONENT
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Jan 11, 2023
filing date -
Jan 11, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
This composite molded component includes: an internal component that includes an electronic component body (element body portion) and at least one lead wire extending from the element body portion; a primary molded portion covering the internal component; and a secondary molded portion covering the primary molded portion. In this composite molded component, at least a portion of the lead wire is a soldering portion to be soldered to another component (conductor end portion). The primary molded portion includes, in at least a portion of the portion that faces the soldering portion, a recessed portion that forms a gap with the lead wire.
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