TEMPERATURE MEASUREMENT ASSEMBLY, SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Jul 15, 2024
filing date -
Jul 15, 2024
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Abstract
There is provided a technique that includes: a gas supply pipe including therein a flow path through which a gas flows; at least one temperature sensor including a temperature measurement gauge disposed outside the gas supply pipe; and a protective tube inside which the gas supply pipe and the at least one temperature sensor are disposed, wherein an outlet of the gas supply pipe configured to eject the gas into the protective tube is positioned higher than the at least one temperature sensor, and the gas descends via a gap between an outer wall of the at least one temperature sensor and an inner wall of the protective tube.
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