Sensing Arrangements for Camera Modules
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 27, 2023
filing date -
Sep 27, 2023
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Abstract
Described herein are sensing arrangements for a camera module that include a position sensor, a temperature sensor, a driver chip, and a multiplexer. The position sensor has a first bias input and a first set of terminals. The temperature sensor has a temperature-sensitive resistor, a second bias input, and a second set of terminals. The driver chip includes a bias output connected to a bias current source and a set of inputs for receiving a voltage signal. The multiplexer is configured to selectively connect the position sensor or the temperature sensor to the driver chip, such that, the bias output is connected to the first or the second bias input, respectively, and the set of inputs is connected to the first or the second set of terminals, respectively, thereby causing the voltage signal received by the set of inputs to indicate a position or a temperature of the camera module, respectively.
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