AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE
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United States of America Patent
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Mar 27, 2025
app pub date -
Sep 19, 2024
filing date -
Sep 19, 2024
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Abstract
Disclosed an airflow sensor and an airflow sensor packaging structure. a substrate, a vibrating electrode, and a fixed electrode in a laminated arrangement, wherein the substrate has a back cavity passing through in its thickness direction. it is intended to provide at least one pressure equalizing structure on the airflow sensor, and the pressure equalizing structure physically isolating itself from the gap layer, so as to establish a continuous flow path in the space between the back cavity of the airflow sensor and the space outside the airflow sensor.
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