LIQUID EJECTION HEAD SUBSTRATE, LIQUID EJECTION HEAD, AND LIQUID EJECTION APPARATUS

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United States of America Patent

APP PUB NO 20250100278A1
SERIAL NO

18896297

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A technology capable of efficiently dissipating heat in a printing element substrate with a temperature adjustment heating element mounted thereon is to be provided. A liquid ejection head substrate capable of ejecting liquid using energy generated by an energy generating element includes: a base; a first heat transfer layer configured to be installed below the energy generating element, and formed by being laminated on the base via an insulating layer; a temperature adjustment heating element configured to be capable of adjusting the temperatures of the liquid and the liquid ejection head substrate; and a first heat transfer member configured to connect the first heat transfer layer and the base, wherein the first heat transfer member is installed between adjacent ones of a plurality of the energy generating elements and between the energy generating element and the temperature adjustment heating element.

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Patent Owner(s)

Patent OwnerAddress
CANON KABUSHIKI KAISHAJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ISHIDA, YUZURU Kanagawa, JP 72 288
MIURA, YOSUKE Tokyo, JP 25 300

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