SUBSTRATE SUPPORT ASSEMBLY WITH MULTIPLE DISCS
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 22, 2023
filing date -
Sep 22, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A method for bonding components of an electrostatic chuck includes applying a first melting point depressing layer (MDL) to a bottom surface of a first puck plate including one or more functional elements of an electrostatic chuck. A second MDL is applied to a top surface of a second puck plate including one or more functional elements of the electrostatic chuck, and a metal interlayer is provided between the first MDL and the second MDL. The first puck plate, the metal interlayer, and the second puck plate are aligned to form a puck assembly, and the puck assembly is heated, to a temperature at or near the eutectic temperature of the first MDL or the second MDL, to thermally bond the first puck plate to the metal interlayer and the metal interlayer to the second puck plate.
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