NON-ORIENTED FILM, LAMINATED BODY, AND PACKAGE

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United States of America Patent

APP PUB NO 20250100200A1
SERIAL NO

18730850

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Abstract

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The present invention relates to a non-oriented film, a laminated body, and a package; the non-oriented film has a sealant layer composed of a resin composition including 30 to 90 mass % of a propylene-based polymer (A) and 10 to 70 mass % of a 1-butene/α-olefin copolymer (B), and a substrate layer; the propylene-based polymer (A) has a melting point (Tm) measured by differential scanning calorimetry (DSC) of 120° C. or higher and 135° C. or lower, and contains 50 to 90 mol % of a propylene-derived constitutional unit; the copolymer (B) has a melting point measured by DSC of lower than 120° C. or has no melting point observed by DSC, and contains 50 to 99 mol % of a 1-butene-derived constitutional unit and 1 to 50 mol % of an α-olefin-derived constitutional unit (provided that a total of the 1-butene-derived constitutional unit and the α-olefin-derived constitutional unit is 100 mol %), the sealant layer has a thickness of 3 to 30 μm, and the substrate layer has a thickness of 10 to 100 μm.

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Patent Owner(s)

Patent OwnerAddress
MITSUI CHEMICALS INC2-1 YAESU 2-CHOME CHUO-KU TOKYO 1040028 ?1040028

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
EGAWA, Makoto Ichihara-shi, Chiba, JP 17 45
HOYA, Hiroshi Kawasaki-shi, Kanagawa, JP 40 453
KAI, Yuki Nobeoka-shi, Miyazaki, JP 14 2
KAMIYA, Nozomi Chiba-shi, Chiba, JP 10 11
MIZUMA, Takahiro Funabashi-shi, Chiba, JP 5 0
SHIOZAKI, Nao Ichikawa-shi, Chiba, JP 4 0

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