BONDING MACHINE BOND HEAD HAVING SIX DEGREES OF FREEDOM
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 27, 2023
filing date -
Sep 27, 2023
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Abstract
A bond head having a bonding tool for bonding an electronic component includes a rotary motion mechanism and a linear positioning mechanism coupled to the rotary motion mechanism. The rotary motion mechanism is operative to rotate the bonding tool for adjusting an angular orientation of the electronic component held by the bonding tool. The rotary motion mechanism includes a rotary assembly operative to rotate the bonding tool about a first rotary axis and a flexural rotary table operative to rotate the bonding tool about respective second and third rotary axes, the first, second and third rotary axes being orthogonal to one another. The linear positioning mechanism is operative to drive the bonding tool to move parallel to the first rotary axis as well as a first plane that is parallel to a second plane on which the second and third rotary axes are located to adjust the position of the electronic component.
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