SEPARATION CHIP
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Sep 24, 2024
filing date -
Sep 24, 2024
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Abstract
A separation chip includes a substrate, a plurality of electrodes disposed on one-side surface of the substrate, an insulation film covering at least a part of one-side surface of each of the electrodes, and an introduction-portion constituting member that is disposed on one side of the substrate, surrounds at least a portion of the electrodes, and defines an introduction portion into which a liquid containing dielectric particles is introduced. The one-side surface of each of the electrodes has a first region and a second region different from the first region. A thickness of the insulation film on the first region is smaller than a thickness of the insulation film on the second region.
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