INTEGRATED CENTRALIZED VACUUM INTERCONNECTION SYSTEM DEVICE
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United States of America Patent
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Issued Date -
Mar 27, 2025
app pub date -
Mar 28, 2024
filing date -
Mar 28, 2024
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Abstract
An integrated centralized vacuum interconnection system device is provided, which belongs to the field of vacuum interconnection technology. The device includes an interconnection tower, the top of the interconnected tower is connected with an evaporation pattern direct writing device, the interconnected tower is connected with a combined modular measuring device on the adjacent side below the evaporation pattern direct writing device, the middle of the interconnected tower is connected with a fast extension module device and a fast separation damping device respectively, a side of the middle part of the interconnected tower and the lower part of the middle part of the interconnected tower are equipped with a combined modular evaporation device. The present invention provides an integrated centralized vacuum interconnection system device that integrates sample preparation, sample characterization, device fabrication, and comprehensive measurement components. The central functions of each component are executed on a replaceable universal module.
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