QUANTUM DEVICE AND METHOD OF MANUFACTURING SAME
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Mar 20, 2025
app pub date -
May 22, 2024
filing date -
May 22, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A quantum device using a quantum state, including a quantum chip, a wiring component having a wiring layer, and a laminated substrate installed so that at least the surface of the wiring component on which the quantum chip is mounted is exposed, wherein a wiring layer of the laminated substrate and the wiring layer of the wiring component are connected by an integrated conductor pattern.
First Claim
Family
International Classification(s)
- No Non-US Classification to display
Cited Art Landscape
Patent Citation Ranking
- Citation Ranking not provided
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully