Importance

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Abstract

A microelectronic device comprises a stack structure, slot structures vertically extending completely through the stack structure, and support pillar structures vertically extending through the stack structure. The stack structure comprises tiers vertically stacked relative to one another, each tier including a conductive material and insulative material vertically neighboring the conductive material. The stack structure includes a staircase structure therein comprising steps defined by edges of at least some of the tiers. The support pillar structures are arranged in rows horizontally extending in a first direction. The slot structures divide the stack structure into block structures. The microelectronic device further comprises additional slot structures within a horizontal area of one of the block structures. The additional slot structures include a first additional slot structure at least partially intersecting one of the rows of the support pillar structures. The additional slot structures also include a second additional slot structure horizontally spaced apart from the first additional slot structure and each of the rows of the support pillar structures in a second direction orthogonal to the first direction.

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First Claim