UNIVERSAL RUGGEDIZED COMPUTER ENCLOSURE WITH FORCED AIR AND EXTERNAL MIST COOLING
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Sep 26, 2024
filing date -
Sep 26, 2024
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Abstract
In one embodiment, an enclosure device for a printed circuit board (PCB) includes an enclosure wall structure enclosing an enclosure interior which has a PCB space in which to dispose the PCB. The enclosure wall structure includes therein an internal geometry of a monolithic heat exchanger core of a monolithic heat exchanger having a plurality of internal channels. The enclosure wall structure includes one or more vents. One or more fans are configured to drive air via one or more inlets from an enclosure exterior outside of the enclosure wall structure through the internal channels and out of the one or more vents. A plurality of misters are disposed at a plurality of misting locations external of the enclosure wall structure to deliver a misting fluid to the plurality of misting locations for cooling an exterior of the enclosure wall structure.
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