PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Sep 19, 2023
filing date -
Sep 19, 2023
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Abstract
A substrate comprising a core layer, at least one first dielectric layer coupled to a first surface of the core layer, at least one second dielectric layer coupled to a second surface of the core layer, a plurality of interconnects located at least partially in the at least one first dielectric layer; a region comprising a plurality of block interconnects of an interconnect block; and a solder resist layer coupled to the at least one first dielectric layer.
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