Component Carrier and Method of Manufacturing the Same
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Sep 20, 2023
filing date -
Sep 20, 2023
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Abstract
A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a solder resist structure on at least one of two opposing main surfaces of the stack. The solder resist structure includes at least two different kinds of solder resist provided on one of said main surfaces.
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