INTEGRATED CIRCUIT FOR WIRELESS POWER RECEIPTION AND BLUETOOTH COMMUNICATION AND BLUETOOTH COMMUNICATION METHOD USING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Mar 20, 2025
app pub date -
Jun 28, 2024
filing date -
Jun 28, 2024
priority date (Note) -
Published
status (Latency Note)
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Importance

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Abstract
The present specification relates to an integrated circuit for wireless power supply and Bluetooth communication, and a Bluetooth communication method using the same. The integrated circuit includes: an antenna unit that receives a first radio frequency (RF) signal and a second RF signal from an external terminal; a power harvesting unit that generates power based on the first RF signal and the second RF signal; a radio frequency identification (RFID) tag that receives issuance data and initialization data included in the first RF signal through the antenna unit; a memory unit that is initialized by the initialization data, receives the issuance data from the RFID tag, and stores the issuance data; a Bluetooth low energy (BLE) transmitting unit that generates an output signal based on the issuance data and transmits the output signal to the external terminal through the antenna unit; a control unit that loads the issuance data from the memory unit and controls the BLE transmitting unit based on the issuance data; and a power storage unit that stores power generated from the power harvesting unit.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
3A LOGICS INC | N-5F 26 GEUMTO-RO 40BEON-GIL SUJEONG-GU SEONGNAM-SI GYEONGGI-DO 13453 |
International Classification(s)

- 2024 Application Filing Year
- H04B Class
- 3624 Applications Filed
- 226 Patents Issued To-Date
- 6.24 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
KIM, Sung Wan | Gyeonggi-do, KR | 57 | 592 |
# of filed Patents : 57 Total Citations : 592 |
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- 0 Citation Count
- H04B Class
- 0 % this patent is cited more than
- < 1 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Sep 20, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 20, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 20, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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