ELECTRONIC PACKAGE STRUCTURE
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Dec 3, 2024
filing date -
Dec 3, 2024
priority date (Note) -
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Abstract
The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
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