POWER MODULE
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Mar 20, 2025
app pub date -
Nov 25, 2024
filing date -
Nov 25, 2024
priority date (Note) -
Published
status (Latency Note)
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Importance

US Family Size
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Non-US Coverage
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Abstract
A power converter module includes a ground terminal, an input voltage terminal configured to receive a raw input voltage, and an interconnection terminal configured to provide a regulated output voltage to a load such as a SOC or SIP system to be powered. A voltage regulator is connected to the ground terminal and the input voltage terminal. An inductor has an inductor output connected to the interconnection terminal.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
US | B2 | US11245329 | Feb 21, 2018 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Power module | Feb 08, 2022 | |||
TW | A | TW201915636 | Jun 22, 2018 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
LAID OPEN APPLICATION FOR PATENT OR PATENT OF ADDITION | POWER CONVERTER MODULE | Apr 16, 2019 | |||
CN | A | CN109586571 | Jun 26, 2018 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Power converter module | Apr 05, 2019 | |||
US | B2 | US11855539 | Feb 01, 2022 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Power module | Dec 26, 2023 | |||
US | B2 | US12155307 | Dec 26, 2023 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
GRANTED PATENT AS SECOND PUBLICATION | Power module | Nov 26, 2024 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MFG CO LTD | NO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU |
International Classification(s)

- 2024 Application Filing Year
- H02M Class
- 1291 Applications Filed
- 76 Patents Issued To-Date
- 5.89 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hsu, Ying-Chih | Hsinchu City, TW | 26 | 119 |
# of filed Patents : 26 Total Citations : 119 | |||
Roth, Alan | Leander, US | 111 | 893 |
# of filed Patents : 111 Total Citations : 893 | |||
Soenen, Eric | Austin, US | 112 | 728 |
# of filed Patents : 112 Total Citations : 728 |
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Patent Citation Ranking
- 0 Citation Count
- H02M Class
- 0 % this patent is cited more than
- < 1 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Sep 20, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 20, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 20, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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