SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

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United States of America

APP PUB NO 20250096180A1
SERIAL NO

18823149

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Abstract

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A semiconductor device includes a semiconductor element; an interconnect layer provided on a first surface side of the semiconductor element, the interconnect layer including an interconnect connected to the semiconductor element and an insulating layer covering the interconnect; and a cavity provided between the first surface of the semiconductor element and the interconnect layer.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU LIMITEDKAWASAKI-SHI KANAGAWA 211-8588

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hara, Naoki Sagamihara, JP 60 557
Kumazaki, Yusuke Atsugi, JP 11 8
Nakasha, Yasuhiro Hadano, JP 25 171
Ohki, Toshihiro Hadano, JP 63 1380
Okamoto, Naoya Isehara, JP 120 1023
Ozaki, Shirou Yamato, JP 83 1110

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