Antenna Apparatus and Method

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250096167A1
SERIAL NO

18969430

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Abstract

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A package structure includes a first die, a second die over and electrically connected to the first die, an insulating material around the second die, a first antenna extending through the insulating material and electrically connected to the second die, the first antenna being adjacent to a first sidewall of the second die, wherein the first antenna includes a first conductive plate extending through the insulating material, and a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is between the plurality of first conductive pillars and the first sidewall of the second die.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MFG CO LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuo, Feng-Wei Zhudong Township, TW 110 154
Liao, Wen-Shiang Toufen Township, TW 139 787

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