PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF
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United States of America
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Mar 20, 2025
app pub date -
Jan 24, 2024
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Jan 24, 2024
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Abstract
A semiconductor device includes a substrate having a plurality of chip regions. In some embodiments, the semiconductor device further includes a plurality of scribe lines interposing the plurality of chip regions. In some examples, the semiconductor device further includes a first plurality of alignment mark regions distributed within the plurality of scribe lines. In some embodiments, the semiconductor device further includes a second plurality of alignment mark regions distributed within each of the plurality of chip regions.
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