SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Mar 20, 2025
app pub date -
Jul 24, 2024
filing date -
Jul 24, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A semiconductor device, including: a first board and a second board facing each other with a space therebetween; a heat dissipation base having a front surface, on which the first board is bonded via a first f solder layer and the second board is bonded via a second solder layer; and a resist formed along the first solder layer and the second solder layer. The first solder layer has an edge portion thereof, which is a first edge portion, facing the second solder layer. The second solder layer has an edge portion thereof, which is a second edge portion, facing the first solder layer. The resist is in contact with the first edge portion and the second edge portion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully