PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Sep 20, 2023
filing date -
Sep 20, 2023
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Abstract
A package comprising a first substrate; a first integrated device coupled to the first substrate through at least a first plurality of solder interconnects; a second substrate coupled to the first substrate through at least a second plurality of solder interconnects, wherein the second substrate includes a cavity; and an encapsulation layer located at least between the first substrate and the second substrate, wherein the encapsulation layer is coupled to the first substrate, the second substrate and the first integrated device.
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