SUBSTRATE PROCESSING MONITORING
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Dec 2, 2024
filing date -
Dec 2, 2024
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Abstract
A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.
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