SUBSTRATE TREATMENT APPARATUS HAVING HEATING PART

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250096031A1
SERIAL NO

18424117

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present disclosure relates to a substrate treatment apparatus including: a chuck base having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on the lower portion of the inner peripheral surface of the spin chuck; a back nozzle assembly mounted through a hollow portion formed at the center of the chuck base to spray treatment liquid onto the underside of the substrate; cover glass disposed between top of the spin chuck and the back nozzle assembly; and a heating part located inside the inner peripheral surface of the spin chuck in a space between the cover glass and the chuck support part, wherein the spin chuck is separably coupled to the chuck support part in an up-down direction.

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Patent Owner(s)

Patent OwnerAddress
DEVICEENG CO LTD169 EUMBONG-RO EUMBONG-MYEON ASAN-SI CHUNGCHEONGNAM-DO 31415

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Hee Won Cheonan-si, KR 25 31
Lee, Taek Youb Cheonan-si, KR 20 912

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