Composition For Forming Organic Film, Method For Forming Organic Film, And Patterning Process

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United States of America

APP PUB NO 20250095989A1
SERIAL NO

18825736

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Abstract

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The present invention is a composition for forming an organic film, containing: (A) a polymer having a repeating unit represented by the following general formula (1); (B) a resin for forming an organic film; and (C) a solvent, where R1 represents a divalent organic group having 2 to 30 carbon atoms including an aliphatic moiety or an aromatic moiety, each R2 independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxy group, an alkoxy group having 1 to 6 carbon atoms, a halogen atom other than a fluorine atom, a cyano group, an amino group, or a nitro group, and “a” represents 0 or 1, “b” representing 1 to 4 and “c” representing 0 to 3 when “a” is 0, or “b” representing 1 to 6 and “c” representing 0 to 5 when “a” is 1. This can provide a composition for forming an organic film having excellent film-formability on a substrate and excellent filling property, and being excellent in hump-suppression at the time of an EBR process.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTD6-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NIIDA, Keisuke Joetsu-shi, JP 22 52
YAMAMOTO, Yasuyuki Joetsu-shi, JP 126 669

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