Composition For Forming Organic Film, Method For Forming Organic Film, And Patterning Process
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Mar 20, 2025
app pub date -
Sep 5, 2024
filing date -
Sep 5, 2024
priority date (Note) -
Published
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
The present invention is a composition for forming an organic film, containing: (A) a polymer having a repeating unit represented by the following general formula (1); (B) a resin for forming an organic film; and (C) a solvent, where R1 represents a divalent organic group having 2 to 30 carbon atoms including an aliphatic moiety or an aromatic moiety, each R2 independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxy group, an alkoxy group having 1 to 6 carbon atoms, a halogen atom other than a fluorine atom, a cyano group, an amino group, or a nitro group, and “a” represents 0 or 1, “b” representing 1 to 4 and “c” representing 0 to 3 when “a” is 0, or “b” representing 1 to 6 and “c” representing 0 to 5 when “a” is 1. This can provide a composition for forming an organic film having excellent film-formability on a substrate and excellent filling property, and being excellent in hump-suppression at the time of an EBR process.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SHIN-ETSU CHEMICAL CO LTD | JAPAN |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
NIIDA, Keisuke | Joetsu-shi, JP | 22 | 52 |
# of filed Patents : 22 Total Citations : 52 | |||
YAMAMOTO, Yasuyuki | Joetsu-shi, JP | 126 | 669 |
# of filed Patents : 126 Total Citations : 669 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- < 1 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Sep 20, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 20, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 20, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
