PLASMA PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250095981A1
SERIAL NO

18279692

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object of the invention is to provide a plasma processing method capable of preventing a protective film from being deposited in a direction parallel to a substrate surface to block an opening of a mask pattern and improving pattern processing even in a narrow space.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATIONTOKYO 105-6409

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIU, Jiahui Tokyo, JP 30 148
SATO, Mafumi Tokyo, JP 2 1
UNE, Satoshi Tokyo, JP 13 5
WATANABE, Hayato Tokyo, JP 36 151
YAMAMOTO, Yuya Tokyo, JP 56 134

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