CAPACITOR ASSEMBLY PACKAGE STRUCTURE
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
May 9, 2024
filing date -
May 9, 2024
priority date (Note) -
Published
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Importance

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Abstract
A capacitor assembly package structure includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating package body. The second bottom electrode structure is separate from the first bottom electrode structure. The capacitor assembly is disposed on the first bottom electrode structure and the second bottom electrode structure. The capacitor assembly includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating package body is configured to cover the capacitor elements of the capacitor assembly. Each capacitor element has a raised protruding structure disposed on the positive electrode portion to reduce a shortest vertical distance between the positive electrode portion and the negative electrode portion of each capacitor element.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
APAQ TECHNOLOGY CO LTD | 4 F NO 6 KEDONG 3RD RD ZHUNAN TOWNSHIP MIAOLI COUNTY 35053 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
CHANG, CHE-WEI | MIAOLI COUNTY, TW | 202 | 784 |
LAI, YUH-SHYUAN | Tainan City, TW | 1 | 0 |
LAN, SHANG-CHE | KAOHSIUNG CITY, TW | 6 | 1 |
MA, SHUO-YEN | Changhua County, TW | 1 | 0 |
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