CAPACITOR ASSEMBLY PACKAGE STRUCTURE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250095925A1
SERIAL NO

18659095

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A capacitor assembly package structure includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating package body. The second bottom electrode structure is separate from the first bottom electrode structure. The capacitor assembly is disposed on the first bottom electrode structure and the second bottom electrode structure. The capacitor assembly includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating package body is configured to cover the capacitor elements of the capacitor assembly. Each capacitor element has a raised protruding structure disposed on the positive electrode portion to reduce a shortest vertical distance between the positive electrode portion and the negative electrode portion of each capacitor element.

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Patent Owner(s)

Patent OwnerAddress
APAQ TECHNOLOGY CO LTD4 F NO 6 KEDONG 3RD RD ZHUNAN TOWNSHIP MIAOLI COUNTY 35053

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, CHE-WEI MIAOLI COUNTY, TW 202 784
LAI, YUH-SHYUAN Tainan City, TW 1 0
LAN, SHANG-CHE KAOHSIUNG CITY, TW 6 1
MA, SHUO-YEN Changhua County, TW 1 0

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