Wireless Power Transfer Thin Profile Coil Assembly
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Oct 27, 2024
filing date -
Oct 27, 2024
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Abstract
A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second side thereof, where the second conductor pattern is aligned with the first conductor pattern whereby the second conductor pattern reinforces magnetic flux generated by the first conductor pattern. At least one electrical connection electrically connects the respective conductors of the first and second conductor patterns and the first and second conductor patterns are placed relative to one another so as to provide uniform flux transmission in a same direction. One or more of such printed circuit boards form a wireless power transmission coil assembly with a conductive winding layer, a ferrite flux diversion layer, conformal spacing layers, an eddy current shield layer and an assembly enclosure.
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