Writer With Patterned Hot Seed Layer
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Sep 18, 2023
filing date -
Sep 18, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The present embodiments relate to a write head design with a patterned hot seed (HS). Particularly, the HS can be patterned as part of a multi-step patterning process that can partially or completely remove portions of the HS at multiple sides to form various designs. For example, the HS can have a two-step cliff design, etching multiple steps around an un-patterned center portion, and a flared angle. The designs of the patterned HS can improve write head performance.
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