CONTROL DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Jul 11, 2024
filing date -
Jul 11, 2024
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Abstract
A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.
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