NEAR FIELD WIRELESS COMMUNICATION SYSTEM FOR MOTHER TO PACKAGE AND PACKAGE TO PACKAGE SIDEBAND DIGITAL COMMUNICATION
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Mar 20, 2025
app pub date -
Nov 29, 2024
filing date -
Nov 29, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A high volume manufacturing (HVM) test system including a test device defining an opening configured to receive a package under test, the test device including an external access agent (EAA) including: a first leaky surface wave launcher for near field wireless communication, the first leaky surface wave launcher configured to wirelessly provide sideband signals to and wirelessly receive the sideband signals from a silicon package agent physically positioned in a separate package as the EAA; and a first transceiver electrically coupled to the first leaky surface wave launcher, the first transceiver configured to: process the sideband signals received by the first leaky surface wave launcher; and generate the sideband signals for wireless transmission by the first leaky surface wave launcher.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully