METHOD OF HAVING GOOD THERMAL ISOLATION IN WAFER TEST CASSETTE
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Mar 29, 2024
filing date -
Mar 29, 2024
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Abstract
A wafer test cassette having a fluid inlet and a fluid outlet, includes a first housing, a second housing, a heat source, and an isolation device. The first housing includes a probe card including probes. The second housing is coupled to the first housing, so that a test space is defined. The second housing carries a wafer arranged in the test space, and the probes are electrical contact with an upper surface of the wafer. The heat source heats a lower surface of the wafer, and a high temperature region is defined between the lower surface and the second housing. The solation device surrounds the high temperature region for thermally isolating the high temperature region from the test space. The fluid inlet receives a gas, the gas flows between the probe card and the upper surface of the wafer, and exits through the fluid outlet.
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